*ASEAN Semiconductor and Electronics Forum (ASEF) Opens Today at SMX Convention Center MOA*
*MANILA, Philippines – October 26, 2026 –* The future of the global semiconductor industry takes center stage today as the *ASEAN Semiconductor and Electronics Forum (ASEF)* officially opens at the *SMX Convention Center, Mall of Asia Complex, Pasay City*.
Carrying the theme *“ONE ASEAN, ONE SEMICONDUCTOR FUTURE: Building Resilient and Sustainable Global Value Chains,”* ASEF 2026 gathers over 1,500 delegates — Ministers of Trade and Industry from all 10 ASEAN Member States, CEOs of global chip giants, electronics manufacturers, startups, academe, and development partners — for the first-ever region-wide semiconductor summit hosted by the Philippines as ASEAN Chair.
Why Now, Why ASEAN?
The world is facing a $1 trillion semiconductor demand by 2030, but supply chains remain fragile, concentrated, and carbon-intensive. ASEAN, which contributes *23% of global electronics exports and houses 15% of global ATP (Assembly, Test, Packaging) capacity*, presents the answer: diversification, resilience, and sustainability.
“ASEAN is not just an alternative — ASEAN is the future backbone of the global semiconductor value chain,” said the Philippine Department of Trade and Industry (DTI). “ONE ASEAN, ONE SEMICONDUCTOR FUTURE is our commitment that when the world needs chips, ASEAN delivers — together.”
What’s Happening at SMX MOA Today – Oct 26
*Day 1 Highlights (SMX Halls 1-4):*
*09:00 AM – Opening Ceremony & Leaders Keynote*
Joint declaration by ASEAN Economic Ministers on Semiconductor Cooperation.
*10:30 AM – Panel 1: Mapping ONE ASEAN Value Chain*
From Singapore’s R&D to Malaysia’s OSAT dominance, Vietnam’s fab growth, Thailand’s PCB strength, and the Philippines’ minerals and EMS capabilities — mapping complementarity to avoid competition.
*01:30 PM – Panel 2: Resilient Global Value Chains*
How to build supply chains that can withstand geopolitical shocks, pandemics, and climate disruption. Launch of the *ASEAN Semiconductor Supply Chain Resilience Initiative.*
*03:00 PM – Panel 3: Sustainable Value Chains*
Launch of the *ASEAN Green Semiconductor Framework* — low-carbon fabs, responsible nickel-copper-gallium sourcing, water circularity, and ESG-aligned semiconductor investments.
*04:30 PM – ASEF Business Matching & Exhibit*
120 exhibitors from TSMC partners, Infineon, Amkor, Texas Instruments, STMicro, and ASEAN unicorns showcasing advanced packaging, power electronics for EVs, and AI chips.
The Three Deliverables of ASEF 2026
1. *ASEAN Semiconductor Council* – a permanent private-public body to coordinate investments.
2. *ASEAN Chip Talent Alliance* – commitment to train *100,000 engineers, technicians, and IC designers by 2030* across ASEAN universities.
3. *ASEAN Green Chip Investment Corridor* – streamlined, sustainable, and fast-tracked investments for semiconductor projects within ASEAN.
ONE ASEAN, ONE FUTURE
As one delegate put it: “When one ASEAN nation designs, another fabricates, another tests, another packages. No country can do it alone. But together, we are unbreakable.”
ASEF 2026 runs from *October 26-28, 2026 at SMX MOA*. It is organized by the Department of Trade and Industry Philippines in partnership with the ASEAN Secretariat, SEIPI (Semiconductor and Electronics Industries in the Philippines Foundation, Inc.), and the ASEAN Business Advisory Council.
*For media accreditation and program: http://www.asef2026.ph*
*Contact: ASEF Secretariat – media@asef2026.ph*
*#ASEF2026 #ONEASEANONESemiconductorFuture #ResilientAndSustainable*
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